To-Pmod Surface Mount Using Top & Bottom Hot Air

 
Published on March 9, 2012

Designed for maximum ease-of-use, the patent-pending packaging technology includes a single exposed copper bottom pad with standard IC leads for superior layout and thermal performance. The single exposed bottom makes prototyping easy in applications labs, while the convenient size and lead pitch allow for the same pick-and-place manufacturing as the standard TO-263 package. Package designed for robustness Standard IC leads Single exposed copper pad Short switch node No bond wires for interconnects